Join us for an online industry event, where Marco Koelink will introduce RJR's Photonics packages.
This session will explore Photonic Integrated Circuits (PICs) packaging for high-volume manufacturing. Industry leaders will discuss innovations in PIC packaging, aligning with the mass production standards of CMOS microelectronics. RJR’s solution combines the cost-effectiveness of plastic IC packages used in semiconductors with exceptional performance and reliability.
A key sponsor of the event is PHIX, RJR’s OSAT partner.
